Structural Design

• The clamping mechanism is made of high-strength beryllium copper alloy or spring steel. Through precision stamping and heat treatment processes, it acquires stable elastic performance, ensuring that it can firmly clamp components with minimal clamping force (usually 50-200 克力) without causing damage to the components.
• The conductive contacts are key components of the test clips. Their surfaces are usually gold-plated or rhodium-plated with a coating thickness of 0.5-2μm, ensuring excellent conductivity (contact resistance ≤5mΩ) as well as good wear resistance and oxidation resistance.
• The insulated handle is mostly injection-molded from high-temperature resistant engineering plastics (such as POM or PEEK) with an anti-slip texture design, ensuring stability and safety during operation.

Types and Classifications

• For two-terminal components such as SMD resistors and capacitors, tweezer-type test clips feature adjustable tip spacing, usually ranging from 0.2mm to 5mm, which can adapt to different sizes of SMD components.
• Probe-type test clips for IC chips integrate multiple sets of precision probes with diameters of only 0.1-0.3mm, which can accurately contact chip pins, suitable for testing integrated circuits in packages such as QFP and SOP.
• There are also magnetic test clips specifically designed for magnetic components like SMD inductors and transformers, which improve testing efficiency through magnetic adsorption-assisted positioning.
• Some high-end test clips are equipped with cable interfaces, allowing direct connection to equipment such as multimeters and oscilloscopes for real-time data transmission.

Material Selection

• Clamping arm materials need to meet both elasticity and conductivity requirements. Beryllium copper alloy, with its high elastic limit and excellent conductivity, becomes the first choice for high-end test clips, but at a higher cost. Spring steel has lower cost and good elasticity but requires plating to improve conductivity.
• Contact materials require low contact resistance and high wear resistance. Pure gold plating offers the best conductivity but is costly. Palladium-nickel alloy plating has higher cost-effectiveness and better wear resistance than pure gold, making it suitable for frequent use scenarios.
• Insulating materials need good mechanical strength and electrical insulation properties. PEEK material has outstanding high-temperature resistance (long-term use temperature up to 200℃ or higher), suitable for high-temperature testing environments. POM material has high mechanical strength and good processability, widely used in ordinary testing scenarios.

Usage Specifications

• Before testing, select appropriate test clips according to component size and package type to ensure that contacts are fully aligned with component pins or electrodes, avoiding measurement errors caused by poor contact.
• The force should be moderate when clamping components. Excessive force may damage components or test clip tips, while insufficient force may result in excessive contact resistance.
• Clean the contact surfaces before testing. Wipe with anhydrous alcohol to remove oxide layers and stains, ensuring good conductivity.
• For testing precision components, it is recommended to practice clamping on waste boards first to familiarize oneself with the operation feel before testing formal components.
• After use, place the test clips back in their dedicated packaging box to avoid tip collision and deformation. Apply anti-rust grease to contact surfaces when not in use for a long time.

Application Scenarios

• In the electronic R&D stage, engineers use test clips to quickly verify SMD component parameters without welding, greatly improving R&D efficiency.
• On production lines, quality inspectors conduct sampling inspections of SMD components through test clips, promptly identifying defective products and ensuring product quality.
• In the maintenance field, maintenance personnel use test clips to directly detect faulty components on circuit boards, determining component quality without disassembly and reducing maintenance risks.
• In teaching experiments, test clips enable students to safely and conveniently practice SMD component testing, deepening their understanding of electronic component characteristics.

Maintenance

• During daily use, avoid dropping test clips or subjecting them to severe impacts to prevent tip deformation or internal structure damage.
• After each use, check whether contacts are worn or deformed. If severe tip wear or oxidation blackening is found, replace or repair the plating in a timely manner.
• For adjustable test clips, regularly check whether the adjustment mechanism is flexible and add a small amount of lubricating oil if necessary.
• Store in a dry and clean environment, avoiding contact with corrosive gases to prevent contact oxidation and rust.
• For test clips not used for a long time, it is recommended to conduct a power-on check monthly to ensure their electrical performance is normal.

Technological Innovation

• New test clips adopt more precise manufacturing processes, with tip sizes as small as 0.1mm or less, meeting the testing needs of ultra-small components such as 01005 packages.
• Intelligent test clips integrate pressure sensors to real-time monitor clamping force, avoiding component damage caused by improper force.
• Wireless test clips transmit data via Bluetooth, eliminating cable constraints and improving operational flexibility.